The chapter on PCB requirements addresses issues such as delamination, haloing, marking, bow and twist, depanelisation, edge contacts etc.Ī chapter specific for IPC-J-STD-001 is Product assurance. Apart from general information and criteria on cleaning, for instance ultrasonic cleaning, this chapter also describes several cleanliness test methods. Topics on cleaning that are specific for the IPC-J-STD-001 are found in a chapter called Cleaning process requirements. on health and safety, personnel proficiency, terms and definitions, materials, components and equipment requirements, general soldering and assembly requirements, wires and terminal connections, through-hole mounting and terminations, surface mounting of components, and rework and repair. Topics discussed are: general requirements e.g. It gives regulations to be followed for work facilities, such as lighting, temperature and humidity issues. It covers requirements on equipment to be used in soldering processes as well as materials, for instance flux and solder alloys used in this process. IPC-J-STD-001 is the document of choice if you need information on process control in relation to the assembly processes. As is done in the other new document revisions, IPC now also states that the use of the newer revision is not automatically required. In the course of this alignment conflicting criteria in the various documents were addressed by a group of specialists and modifications were made. It was one of the documents for which alignment with other commonly used IPC standards, such as IPC-A-620D and IPC-A-610H, was a major reason for updating. In September 2020 we saw the latest H revision publication of IPC-J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.